Tue, Oct 26, 2021 4:30 PM – 6:00 PM BST
This was our second webinar to support the release of our new Solder Paste Printing & Defect Guide.
Printing solder paste or other conductive material requires a zero defect approach, if a high first pass yield are to be achieved using fine pitch components. Monitoring and control of paste height and volume are becoming the norm in many markets, but what capability can we expect?
Correct printer set-up, good stencil design and manufacture plus consistent materials are key to successful manufacture but inspection and monitoring the performance makes a process more robust. The same three dimensional inspection is required in AOI applications like solder joint analysis. There are common process defects during printing and with this webinar we show you the causes and cures to help yield improvement.
The webinar is based on our “New Solder Paste Print Inspection & Defect Guide” which is provided FREE with the webinar. The session featured lots of macro video shot by the presenter to help illustrate common problem experience in manufactur.
Webinar presented by Bob Willis
Topics covered in the webinar:
- Solder paste inspection standards
- Soldering yield impact with poor printing
- Common solder paste defects
- Impact on reliability based on paste thickness
- Solder joint inspection defects
- Common process defects causes & cures
Cyberoptics | Fraser Technology | Humiseal | Indium | Kolb | Microcare
For more information on how to become a sponsor, which includes promotion on the webinar and a double page feature in the Defect Guide, contact Claire Saunders on firstname.lastname@example.org or call +44 (0) 7584 635 84