In Focus
Defect of the Month – Low Temperature Soldering
Hello, my name’s Bob Willis and welcome to Defect of the Month, sponsored by Solderstar, Humiseal and EVS. This month I wanted to talk about low temperature solder alloys and low temperature soldering. These solders have become quite popular to decrease energy...
Register for the MESA UK Sustainability Event 2023 – 20th September 2023
The MESA UK Sustainability Event 2023, will be held at Fanuc UK, near Coventry, on the 20th of September 2023, free to MESA members, a small charge for others. What’s New in Electronics caught up with organisers Steven Hewitt (Rockwell Automation) & Michael...
Defect of the Month – Non Reflow of Solder Paste
Hello, my name’s Bob Willis and welcome to Defect of the Month. Every month on You Tube we examine one particular type of process defect and provide illustrations, comments and hopefully solutions to point you in the direction to hopefully overcome the issue. If...
WNIE TV & Radio
David Greenman from Humiseal discusses Sharp Edge Coating at SMTConnect 2023
Iain Hazlewood from What’s New in Electronics TV talks to David Greenman from Humiseal at SMTConnect 2023 in Nuremberg, Germany. WNIE TV is kindly sponsored by Humiseal, Koh Young Technology, ART, Kyzen, BTU, ECD, Viscom and...
Viscom vConnect at SMTConnect in Nuremberg, Germany
Claire Saunders from What’s New in Electronics speaks to Detlef Beer and Florian Martin from Viscom on their booth at SMTConnect to find out more about the company’s vConnect software solution. vConnect is Viscom’s platform for everything related to...
Dr Denis Marcon from Innoscience at SMTConnect 2023
Iain Hazlewood from What’s New in Electronics TV talks to Dr Denis Marcon from Innoscience at SMTConnect 2023 in Nuremberg, Germany. WNIE TV is kindly sponsored by Humiseal, Koh Young Technology, ART, Kyzen, BTU, ECD, Viscom and...
News Central
AMD Unveils Purpose-Built, FPGA-Based Accelerator for Ultra-Low Latency Electronic Trading
New AMD Alveo fintech accelerator card provides trading firms and brokerages with breakthrough trade execution performance at nanosecond speed and AI-enabled trading strategies — — Solution partners Alpha Data, Exegy and Hypertec add to growing ecosystem of ultra-low...
GlobalFoundries® and Microchip Announce Microchip’s 28-nm SuperFlash Embedded Flash Memory Solution in Production
GlobalFoundries (GF®) (Nasdaq: GFS) and Microchip Technology (Nasdaq: MCHP), via Microchip’s Silicon Storage Technology® (SST®) subsidiary, today announces the immediate release to production of the SST ESF3 third-generation embedded SuperFlash technology NVM solution...
Shaping the Future of Display Technology at FINETECH JAPAN 2023
Running in conjunction with Highly-Functional Material Week TOKYO, the 33rd FINETECH JAPAN returns to showcase the latest advancements in LCD, OLED, and Micro-LED technologies from October 4 to 6 at Makuhari Messe, Japan, reaffirming its status as the foremost...
Industry Insights
Technical Article – X7R vs. X7S DC-bias & TCC considerations
By Benjamin Blume, Team Leader Application Engineering Europe; and Hank Kang, Product Manager Passive Components, Samsung Electro-Mechanics. The most common MLCCs (multi-layer ceramic capacitors) in the industrial and automotive markets come with a TCC (temperature...
A chip designed just for you?
Why an Application Specific Integrated Circuit (ASIC) can give your product the edge ~ While it may not be common knowledge, ASICs have transformed many electronics products. Even a mid-range vehicle manufactured some years ago will feature a number of specialised...
Three things you need to know about Industry 5.0
~ Industry 5.0 and the ASICs within ~ While manufacturers are still getting accustomed to methods for interconnecting new technologies to improve efficiency and productivity — the guiding principle behind Industry 4.0 — the next phase of industrialisation is already...
Appointments
MIRTEC Announces Robert Horowitz Promoted to National Sales Manager
MIRTEC, the ‘Global Leader in 3D Inspection Technology’ is pleased to announce that Robert Horowitz has been promoted to the position of National Sales Manager for MIRTEC’s North American Sales and Service Division. In his new role, Rob will oversee MIRTEC’s Elite...
ECD Engineering Team Expands with Addition of Software Development Engineer
New Hire Aims to Streamline Current Offerings and Develop New Ground-Up Software Backbone for Company’s Next-Gen Product Line ECD has announced that Seydina Diop has joined the company’s growing engineering team as a Software Engineer II. This is the second ECD...
Ersa Hires New Sales Manager in Indianapolis Area
Kurtz Ersa Inc., the world leader of electronics production equipment, to announce the appointment of Ethan Jones as a Sales Manager for the Rework and Inspection team. Operating from the Indianapolis, IN area, Jones will play a pivotal role in expanding the...
