Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will exhibit at SMTA Guadalajara 2026, taking place October 7-8 at Expo Guadalajara in Salón Jalisco Hall D & E. Attendees are invited to visit Booth 116 to explore practical, production-ready solutions designed to improve PCB assembly quality, consistency, and efficiency.
Featured at the booth will be the new Sawa Ecobrid AH150 stencil cleaner, a fully automatic and compact system engineered for fast, effective removal of solder paste residues. Utilizing low-VOC solvent and ultrasonic cleaning technology, the Ecobrid platform delivers thorough cleaning performance with a takt time of less than 10 minutes, helping manufacturers maintain stencil quality while supporting more environmentally conscious operations.
Additionally, the Sawa Eco-Roll helps manufacturers reduce consumable costs by extending the life of stencil printer wiper rolls. The system cleans used rolls in approximately 20 minutes, allowing them to be reused while reducing waste and lowering CO₂ emissions.
Seika will also showcase the Sayaka CT23S tabletop router, a high-speed precision depaneling solution designed for stress-free separation of complex PCBs. The system delivers clean, accurate cuts with minimal mechanical stress, helping protect sensitive components and improve overall product reliability. With easy onboard programming and support for a wide range of board materials and thicknesses, the CT23S is well-suited for both prototype and production environments.
Rounding out the lineup is the Malcom RCX profiler system, a reflow process analyzer that provides real-time thermal profiling to enhance soldering process control. By delivering accurate temperature data throughout the reflow cycle, the RCX enables manufacturers to optimize oven settings, improve solder joint quality, and reduce defects.
Together, these solutions reflect Seika Machinery’s focus on helping electronics manufacturers streamline key processes—from stencil cleaning and depaneling to reflow optimization—while improving yield and overall production performance.
Visit Booth 116 at SMTA Guadalajara 2026 to see how Seika Machinery supports smarter, more efficient PCB assembly.
For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com.
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