BTU International, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor packaging markets will exhibit at SMTA Guadalajara 2026, taking place October 7-8th in Guadalajara, Mexico. Attendees can visit BTU at Booth 745 at Expo Guadalajara, where the company will showcase its latest Aurora reflow technology tailored for heavy boards and high-yield applications.
Highlighted in the booth will be BTU’s Aurora platform which includes the 200N model – a high-capacity reflow system designed for processing large, heavy printed circuit board assemblies used in AI infrastructure, high-performance computing, networking, and datacenter applications. With 200 inches of heated length, flexible heating and cooling configurations, and advanced conveyor technologies, the Aurora 200N delivers the thermal performance required to process increasingly complex and thermally challenging assemblies while maintaining exceptional throughput and process consistency.
BTU will also feature its new Aurora Vacuum™ Reflow Oven, a next-generation vacuum reflow system that combines low-void soldering performance with production-ready throughput. Designed with a large-format vacuum chamber and optional dual-lane operation, Aurora Vacuum enables manufacturers to achieve higher yields while maintaining the productivity required for volume electronics manufacturing. The Aurora Vacuum platform incorporates several innovative technologies that distinguish it from conventional vacuum reflow systems. An exclusive vacuum soft-start process minimizes component movement and process-induced defects, while integrated heating within the vacuum chamber provides exceptional thermal profile control and process consistency – even for heavy boards. The system’s three independent conveyor mechanisms maximize throughput and production flexibility, and its spacious 24.4 x 28.0-inch (620 x 711 mm) vacuum chamber accommodates large-format PCBs commonly used in AI infrastructure, networking, and datacenter applications. Optional dual-lane operation further increases manufacturing productivity, delivering the combination of low-void soldering performance, high throughput, and production scalability required for next-generation electronics manufacturing.
“With the rapid growth of AI infrastructure and high-performance computing, our customers are handling larger boards and more complex assemblies than ever before,” said Marcos Perez, BTU Regional Sales Manager. “Our Aurora series is purpose-built to meet these demands, offering the thermal power, zone configurability, and profile control needed to achieve void-free, reliable solder joints at production scale.”
With decades of experience in thermal processing, BTU works closely with customers to develop reflow solutions that align with specific process requirements, goals, and facility constraints.
Engineers and manufacturers attending SMTA Guadalajara are encouraged to visit BTU’s booth to learn more about the Aurora and Aurora Vacuum™ systems and discuss their application requirements.
Visit BTU at Booth 745 to see the latest Aurora technologies and meet with BTU thermal process experts.
More information about BTU International is available at www.btu.com.