ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Kalyan Nukala, M.S.Ch.E., Application Engineer, ZESTRON Americas, will present “Assessing the Implications of Fine Mesh Solder Powder on Flux Residue Removal” at SMTA International in Rosemont, IL.
At IPC APEX 2018, a study titled ‘Jet Printed Solder Paste and Cleaning Challenges’ was demonstrated that as solder powder becomes finer, the resulting flux residues become more difficult to remove. As a continuation of the IPC APEX 2018 discussion, this study will test a common no clean flux chemistry with finer SAC305 solder powder with a variety of cleaning chemistries and methods in an effort to quantify the implications of finer mesh powder on flux removal. For this study, cleanliness levels were measured using visual inspection, SIR and ion chromatography per IPC guidelines. As a result of this analysis factors effecting the cleaning efficacy of fine mesh powder were identified.
Mr. Nukala will present during the Manufacturing Excellence Track on October 17th at 11:30 AM, along with Timothy O’Neill from AIM and Terry Munson from Foresite. For more information about the session, or to register please visit smta.org.