High Thermal Impact Reliability Water-Soluble Solder Paste from SHENMAO Wins 2023 NPI Award

SHENMAO America, Inc. received a 2023 NPI Award in the category of Soldering Materials for its PF918-PW216 water-soluble high thermal impact reliability solder paste. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.

PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys. 

 According to the cleaning process requirements of some customers, PF918-PW216 is a specially designed solder paste that is cleanable with water. In addition, PF918 has superior thermal cycling reliability performance suitable for automotive devices and high-power components with high thermal reliability requirements. Board level thermal cycling test results with a real automotive IC product show that the thermal cycling life of PF918 is twice as long as the SAC305 alloy.

PF918-PW216 is halogen-free (ORH0) and complies with RoHS. RoHS 2.0 and REACH. The innovative flux design provides excellent voiding performance. The paste has a similar melting point to SAC305 so that the regular SAC305 reflow profile can be applied.

PF918-PW216 is designed for consumer electronics, servers, automotive electronics and long service life electronic products with high reliability requirements.

Introduced in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

For more information, please visit www.shenmao.com.