BTU to Show Vacuum Reflow Oven for Superior Profile Control at SEMICON China

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced plans to exhibit at SEMICON China, scheduled to take place March 17-19, 2021 at the Shanghai New International Expo Centre. The PYRAMAX™ Vacuum Reflow Oven will be displayed in the CohPros booth, Hall E7 #7343.

 “We are excited to bring the great benefits of vacuum reflow to the China market,” said Ewing Hsieh, director sales Asia Pacific. “The award-winning PYRAMAX Vacuum is the best performing vacuum reflow oven available today for high-volume manufacturing applications where yield loss due to voiding cannot be tolerated.”

The PYRAMAX Vacuum reflow oven has been designed to meet the solder voiding requirements and high-volume demands of electronics assembly and semiconductor packaging applications. The unit is configured with 10 zones of closed-loop convection heating, two zones of convection vacuum chamber heat assist and an internal vacuum chamber heater for precise profile control.  The vacuum chamber can accommodate a maximum product size of 18” by 18”. Nitrogen atmosphere capable, the PYRAMAX Vacuum reflow oven offers a maximum process temperature of 350° C.

To learn more about how the PYRAMAX Vacuum reflow oven can reduce solder voids in your high-volume EMS line, visit www.btu.com.