ZESTRON to Present “Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges” at SMTA Wafer Level Packaging Symposium

ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces that Senior Application Engineer Ravi Parthasarathy will be presenting a technical session titled “Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges” at the upcoming Surface Mount Technology Association (SMTA) Wafer Level Packaging Symposium.

Scheduled for February 13th, 11:30 AM to 12:00 PM, Ravi Parthasarathy’s presentation will delve into the intricacies of enhancing High Bandwidth Memory (HBM) wafer surface treatment processes while addressing the unique cleaning challenges associated with this advanced technology.

As a seasoned professional in the electronics manufacturing industry, Ravi brings a wealth of knowledge and hands-on experience to this presentation. His insights into optimizing HBM wafer surface treatment will prove invaluable for engineers, researchers, and professionals seeking to stay at the forefront of wafer-level packaging advancements.

For more information about the SMTA Wafer Level Packaging Symposium and to attend Ravi Parthasarathy’s presentation, please visit https://smta.org/BlankCustom.asp?page=wafer.