ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce an upcoming webinar on “Enhancing Performance of Copper Pillar Interconnects through Defluxing”. The webinar will take place on June 15, 2023, at 2:00 PM EST and will be presented by Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas.
During this webinar, Ravi Parthasarathy will provide an in-depth analysis of the effectiveness of pure DI-water and a novel low-concentration cleaning agent in removing flux residues from copper pillar interconnects with 150µm bump pitch and 30µm Cu pillar height. A comparative assessment will be reviewed which was performed utilizing several analytical/functional test methodologies based on the latest IPC and JEDEC standards.
This webinar is part of the ZESTRON Academy Advanced Packaging and Power Electronics: A Webinar Series on the Latest Innovations, Cleaning, and Corrosion Challenges. Participants will have the opportunity to gain insights from a leading expert in precision cleaning solutions and learn about the latest innovations, techniques, and strategies for enhancing the performance and reliability of advanced packaging and power electronics.
Register now to secure your spot and learn more about Enhancing Performance of Copper Pillar Interconnects through Defluxing.