We’re at ASYS Technology Days 2026, and the room is about to fill up. Over two packed days, visitors will be getting hands-on with new technology, fresh ideas and smart factory solutions.
Iain Hazlewood from What’s New in Electronics sets the scene before the doors open. Stay tuned for more coverage from the show.
ASYS Group CEO Jürgen Ries on “Go Beyond”: AI, Autonomy and the Factory of the Future
At ASYS Technology Days 2026, What’s New in Electronics talks with Jürgen Ries, CEO of ASYS Group, just before the doors open on two days of live demos, keynotes and tech sessions.
Jürgen explains why this year’s innovation list was too long for a one-hour keynote, and how a five-year plan and a complete rebuild of ASYS’s hardware and software stack have led to a full factory on show, from module inbound to final assembly and logistics.
He also talks about why embodied AI means the old boundary between machine and software layer is disappearing, how AI is taking over NPI program preparation, and how ASYS customers can expect rising levels of autonomy from the same platform.
ASYS Technology Days 2026 – Tech Tour with Thomas Endler
On Day one of the ASYS Technology Days, the company’s Head of Sales, Thomas Endler, gives viewers a technology tour of the very latest innovations on show at the event.
ASYS Technology Days – Draženko Trkulja, Product Manager, SynapticaOS
On day one of ASYS Technology Days 2026, Kirsty Hazlewood from What’s New in Electronics meets Draženko Trkulja, Product Manager, SynapticaOS at the SynapticaOS station to find out what’s new for the ASYS software platform.
Draženko explains how SynapticaOS, already known for order management, material management and operator support, now has the missing piece that makes it a full MES: traceability
ASYS Technology Days – Mehmet Ipek, Product Manager, DIVISIO Depaneling Systems
Iain Hazlewood from What’s New in Electronics is at the DIVISIO depaneling area at the ASYS Technology Days 2026, where Mehmet Ipek, Product Manager, DIVISIO Depaneling Systems, shows off a brand-new machine.
Day One Wrap-Up at ASYS Technology Days 2026 with Jürgen Ries
It’s the end of a busy first day at ASYS Technology Days 2026, and Iain Hazlewood from What’s New in Electronics catches up with ASYS Group CEO Jürgen Ries, joined by a couple of astronauts. (We’re not actually on the moon, whatever the “Go Beyond” theme suggests.)
Jürgen reflects on a record turnout, early customer feedback and the deep discussions between ASYS product managers, engineers and visitors.
Welcome to day two of ASYS Technology Days 2026. Iain Hazlewood from What’s New in Electronics sets the scene for what could be an even busier day than day one, with a full programme of tech talks and factory tours.
The keynote is under way in the main theatre as we speak, and we hope to catch up with keynote speaker Nicola Winter later in the day.
ASYS Technology Days 2026 – Jürgen Lehner Product Manager VEGO Handling Systems
On day two of ASYS Technology Days 2026, Iain Hazlewood from What’s New in Electronics stands in front of the new VEGO Gen S handling series with Jürgen Lehner, Product Manager, VEGO Handling Systems, for a full overview. Developed over the last two years, the series launches with up to 15 different module types.
Its modular design means each component, once developed, is reused across other modules and other ASYS divisions, which cuts the number of components dramatically. By ASYS’s own calculation, spare part inventory drops by more than 50%. Sustainability is built in too.
The whole VEGO line is fully electric, with all pneumatics removed and no compressed air needed. That means lower energy consumption from more powerful machines, longer lifetime, fewer maintenance intervals and less installation effort.
ASYS Technology Days – Keynote speaker, Nicola Winter
Iain Hazlewood from What’s New in Electronics chats to keynote speaker Nicola Winter at the ASYS Technology Days on what ‘Go Beyond’ means for her…
ASYS Tech Days – Sven Reinfeld, Project Engineer INVENTUS Final Assembly & ATHOS Testing, ASYS Group
On day two of ASYS Technology Days 2026, Iain Hazlewood from What’s New in Electronics tours the test and assembly area with Sven Reinfeld, Project Engineer INVENTUS Final Assembly & ATHOS Testing, ASYS Group, covering three highlights. First is a new inline hot and cold test solution, which Sven says is a first for the market. It uses 50% less floor space, 30% less energy and 30% less capex, and runs without ice or condensation on the machine, a common problem with competing systems. Next is a stress-free approach to contacting PCBs in line: the conveyor lowers out of the way, the board is picked up and self-centred with 0.015 mm repeatability at six sigma, and the new GenS interface is as easy to use as a smartphone.
The team also shows a compact in-house laser that physically marks boards good or bad, on top of tracking by DMC code. The tour ends at the modular final assembly cells. They can be scaled from a single cell to interconnected lines with robots and, with SynapticaOS, full factory automation with self-driving storage. They can also be reconfigured for screwing, dispensing, laser or 3D scanning, with a changeover of about 30 minutes, and they use no compressed air to keep costs down.
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