Solderstar to Present Ground-Breaking Reflow Shuttle O2 at SMTconnect 2024

Hall 4, Stand 314

Solderstar, a global leader in temperature profiling equipment for soldering processes, is gearing up to showcase its latest innovation, the Reflow Shuttle with O2 measurement module, at the upcoming SMTconnect exhibition in Nuremberg, Germany.

Scheduled to take place on 11-12 June 2024, the SMTconnect event serves as a premier platform for connecting professionals and technologies in the field of electronics manufacturing across Europe. Solderstar’s participation underlines its commitment to pushing the boundaries of technological advancement in the industry.

The Reflow Shuttle O2 represents a significant leap forward in reflow soldering technology, offering manufacturers an innovative tool for achieving unparalleled precision and control in their soldering processes. This ground-breaking innovation consolidates real-time oxygen (O2) measurement, vibration levels, vacuum reading, temperature profiles, and conveyor speed onto a single robust platform.

Mark Stansfield, CEO of Solderstar, said: “With the Reflow Shuttle O2, we are providing manufacturers with the tools they need to make informed decisions and optimise their reflow soldering processes. By offering detailed insights into all critical parameters, we’re enabling our customers to enhance quality and efficiency in their soldering operations like never before.”

The Reflow Shuttle O2’s zone-by-zone analysis of oxygen levels throughout the reflow process enables manufacturers to precisely monitor oxygen content and detect nitrogen leaks, allowing for immediate adjustments to optimise nitrogen consumption and ensure process quality is maintained.

One of the key features of the Reflow Shuttle O2 is its simple integration into existing reflow ovens, eliminating downtime during verification. Its user-friendly interface enables easy data collection initiation, facilitating rapid adjustments if irregularities are detected. The tool’s versatile design ensures uninterrupted verification across multiple production lines, enhancing overall manufacturing efficiency.

To find out more visit Solderstar at Stand 314, Hall 4, SMTconnect 2024 to explore the future of reflow soldering technology first-hand.