SHENMAO’s New PF606-P245X Lead-Free Solder Paste Wins 2021 Mexico Technology Award

SHENMAO America, Inc. is pleased to announce that it received a 2021 Mexico Technology Award in the category of Solder Paste for its new PF606-P245X Lead-Free Solder Paste. The award was announced at a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.  

With a wide reflow window, PF606-P245X can easily fit into the process of the most complicated PCB designs. The special alloy design provides excellent reliability and improves the life of electronic assembly products. The new paste has been developed for high-speed network and communication applications. 

SHENMAO’s PF606-P245X lead-free solder paste with halogen-free flux design complies with international environmental regulations. Furthermore, PF606-P245X has been successfully adopted by a world-famous satellite internet project. Compared with common pastes, PF606-P245X provides consistent printing performance, low voiding, stable viscosity life and excellent testability. With the wide process window, it can be easily fit into the most complicated PCB assemblies, such as satellite receivers.

The Mexico Technology Awards acknowledge the latest innovations available in Mexico produced by OEM manufacturing equipment and materials suppliers during the last 12 months. For more information, visit 

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