SHENMAO to Exhibit New Solder Pastes with NeVo at productronica

SHENMAO America, Inc. today announced plans to exhibit together with NeVo GmbH at productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. NeVo will showcase Shenmao’s PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste and PF606-P245X Lead-Free Solder Paste.

NeVo is a partner of Shenmao Technology Inc. with exclusive rights for production and sales of Shenmao’s solder products in EMEA. A wide range of products is available including lead-free solder pastes, solder wires, solder bars, solder spheres, solder preforms and other special products. NeVo has two facilities in Czech Republic and is ISO 9001 and ISO 14001 certified.

PF918-P250 paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability. PF918-P250 can increase thermal reliability performance by a minimum of 30 percent. It provides better mechanical shock performance than typical solder alloys such as SAC305 and SAC405, and is suitable for use in consumer electronics, servers and automotive electronics applications.

PF918-P250 has a similar melting point to SAC305 so that the regular SAC305 reflow profile can be applied.  With the innovative flux design, voiding can be easily controlled to less than 10 percent.

With a wide reflow window, PF606-P245X can easily fit into the process of the most complicated PCB designs. The special alloy design provides excellent reliability and improves the life of electronic assembly products. The new paste has been developed for high-speed network and communication applications.

Shenmao’s PF606-P245X lead-free temperature solder paste is specially designed to provide long-term stability over a wide range of temperature conditions. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.

For more information, please visit