SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced Flux SMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.
SMEF-Z3 is compatible with solder paste; the flux can be applied after solder paste printing and cured simultaneously during reflow process. The cured flux enhances solder joint reliability. It can be used for pin-transfer and stencil printing processes.
SHENMAO is unique in the research and development of solder materials in Taiwan.
With the global trend of lead-free development, SHENMAO established the ADVANCED MATERIALS DEVELOPMENT CENTER in Taiwan. The company cooperates with the Industrial Technology Research Institute (Taiwan), Electronics Assembly and IC-packaging manufacturers.
SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.
For more information, please visit www.shenmao.com.