Nihon Superior Co. Ltd., an advanced joining material supplier, is pleased to announce its 55th year in business. Toshiro Nishimura, Chairman and founder, started the company by importing brazing alloys and supplying them to Japanese companies in the metal-joining industry.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. Now with three generations – the chairman, his son, and his grandson – Nihon Superior continues to innovate and develop new markets.
In 1999, Tetsuro Nishimura, President of Nihon Superior Co. Ltd., invented a revolutionary tin-copper-nickel-germanium alloy – SN100C – kickstarting the company as a major player in the global market. Nishimura noted, “The number 55 has extra significance for Nihon Superior as those are also the last digits of the SN100C patent.”
Nishimura went on to say, “For Nihon Superior the important thing about this anniversary is that it gives us an opportunity to thank our customers for their support through the years as the company grew to be a leading global supplier of soldering materials. We are committed to earning our customers’ highest level of trust as we continue to introduce new technologies and products while supporting the Sustainable Development Goals (SDGs).”
Nihon Superior also developed the SN100CVTM alloy that does not contain Ag but can at least match the reliability of SAC305. SN100CV P608 solder paste is a cost-effective replacement for SAC paste. Another innovative product, TipSave N flux-cored solder wire addresses solder tip erosion issues by extending tip life by three times. For high temperature die bonding Alconano® sintering paste has been introduced as an alternative to high-lead solders. The ANP-4 copper filled nano-silver formulation provides a cost-effective, high reliability solution. The company’s mission is to offer high reliability joints to customers in the most cost-effective way.
To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.
Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new flux-cored wire, solder pastes and lead-free products, visit www.nihonsuperior.co.jp/english.