KYOCERA Breaks Ground on New Manufacturing Plant for Ceramic Structural Components in Kagoshima, Japan

New facility will produce durable, high-precision components for semiconductor and LCD manufacturing equipment



Kyocera Corporation (President: Hideo Tanimoto) held a groundbreaking ceremony last week for a manufacturing plant expansion in Kirishima City, Kagoshima, Japan, where it plans to double its production capacity for fine ceramic structural components.


The expansion, scheduled for completion in October 2018, will bring a new building with 29,232 square meters (about 314,650 square feet) of additional space. The new plant will produce fine ceramic structural components used mainly by companies that manufacture semiconductors or liquid-crystal displays (LCDs). 


Kyocera anticipates rising demand for semiconductors and LCDs as Internet of Things (IoT) and artificial intelligence (AI) applications boost demand for high-speed, high-volume data processing. The shift from hard-disk data storage to semiconductor memory and solid-state drives has increased demand for semiconductor processing equipment. Additionally, the proliferation of high-definition (HD) display technology in TVs and smartphones has increased demand for the equipment used to manufacture flat-panel displays. Kyocera’s new plant will produce components used in key manufacturing processes for these and other high-precision products.


Kyocera’s investment will contribute to Kagoshima’s local economy and create employment opportunities. The groundbreaking reflects a construction agreement executed in October between Kyocera and the city of Kirishima.


Details of the New Plant



Kyocera Corporation Kagoshima Kokubu Plant #4-1


On the premises of Kyocera’s existing Kagoshima Kokubu Plant,

1-1 Kokubuyamashita-cho, Kirishima, Kagoshima 899-4396 Japan

Construction cost

Approximately 5.6 billion yen (approx. USD 50.4 million)

Building area


Total floor space


Expected start of operations

October 2018

Main products

Fine ceramic structural components used in semiconductor and flat-panel display manufacturing equipment

First-year production plan

Approximately 3 billion yen (from October 2018 through March 2019)



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