Indium – What’s Best in Solder Paste

Indium have released a selection of White Papers (listed below) and educational videos regarding solder paste solutions.

 

White Papers

Reservoir Printing in Deep Cavities

A Unique Heating/Reflow Technique to Minimize Solder Paste-Induced Voiding under LEDs

Minimizing Voiding in Bottom Terminated Components by Optimising the Solder Paste

Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue?

Does Thermal Cycling Impact the Electrical Rel 99355 R0_final

Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies

Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance 

Voiding Control at High Power Die-Attach Preform Soldering

Does Solder Particle Size Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue? 

Investigating Test Methods for Electrochemical Consistency in PCB Assembly

Volumetric Characterization of Reservoir Printing in Deep Cavities

Investigating Solder Paste Performance after Worst-Case Shipping Scenarios 

Ultra-Low Voiding, Halogen-Free, No Clean, Lead-free Solder Paste for Large Pads

 

Video Content