Indium Corporation Technology Experts to Present at 2016 Electronics Packaging Technology Conference

Indium Corporation’s Jason Chou, Area Technical Manager for Taiwan, and Kenny Chiong, Senior Technical Support Engineer, will present at 2016 Electronics Packaging Technology Conference (EPTC) on Nov. 30-Dec. 3 in Suntec City, Singapore.

Chou and Chiong’s presentation, Test Method to Evaluate a Robust Ball-Grid Array (BGA) Ball-Mount Flux, studied a novel halogen-free BGA ball-mount flux designed to combat missing-ball and ball-bridge defects in the ball-mount process. The presentation discusses five test methods used to verify the flux’s stability and its wide range of applications.

Ball-grid arrays (BGAs) are commonly used in electronics packaging, yet the process steps and thermal treatment prior to the BGA ball-mount process are becoming increasingly complex. This can result in the missing-ball or ball-bridge defects that cause major yield loss during the ball-mount process. In addition, the use of organic solderability preservatives (OSPs) help protect the pad surface from oxidation, but require an additional step for removal prior to the ball-mount process.

Chou provides technical support to Indium Corporation’s customers in Taiwan, with a focus on the semiconductor industry. Chou earned his master’s degree in chemistry from National Tsing Hua University and his bachelor’s degree in chemistry from National Cheng Kung University. He has served as the group leader for the National Nano Device Laboratories, Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.

Chiong is based in Singapore and assists customers in the optimization of manufacturing processes, including technical support for Indium Corporation’s full suite of products. Prior to joining Indium Corporation, Kenny provided technical support for surface mount technology processes, as well as equipment. Additionally, he also reviewed designs for printed circuit board assembly to maintain quality, delivery, and optimal output for manufacturing standards. Chiong holds a bachelor’s degree in mechanical and manufacturing engineering from the Universiti Malaysia Sarawak and has earned his Six Sigma Green Belt.