Indium Corporation is offering a free presentation for students and young professionals to expand their industry knowledge of reflow basics during the virtual exposition at SMTA International from Sept. 28-30.
Kim Flanagan, Technical Support Engineer II, will present Reflow 101 from a Solder Manufacturer’s Perspective as part of SMTA’s Jump Start program. Understanding the reflow process in a soldering application is critical to producing high-quality solder joints. There are many characteristics to be considered when optimizing the solder reflow process in SMT assembly applications. In this presentation, Flanagan will start with the basics of the reflow process, how the solder paste behaves during reflow, and general reflow profiling best practices. She will then discuss some common solder defects and how to troubleshoot and remedy them from a reflow perspective.
The Jump Start Program: Industry Basics to Grow in Your Career will be available to stream in the virtual SMTA booth.
Flanagan provides technical support and guidance on process steps, equipment, techniques, and materials to customers. In addition, she provides technical training to staff and industry partners. Flanagan began her career with Indium Corporation through the company’s summer college internship program, working in the Quality Department. She remained with Indium Corporation as a part-time Quality Engineering Technician while she finished her bachelor’s degree in physics at Le Moyne College in Syracuse. She joined the technical support team in January 2017.
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