The following technical papers from Indium Corporation experts will be featured:
- Versatile TIM Solution with Chain Network Solder Composite by Dr. Ning-Cheng Lee, Vice President of Technology
- An Alternative Lead-Free, Low-Temperature Solder with Excellent Drop Shock Resistance by Dr. HongWen Zhang, R&D Manager, Alloy Group
- Fine Powder Investigation for Optimum Imperial 008004 Solder Paste Printing: Part I by Adam Murling, Assistant Engineering Manager—Technical Support
- Process Optimization for Reducing Solder Paste Splatter During Reflow by Leon Rao, Senior Technical Support Engineer
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA—the world’s leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities. Attendees who register for the Technical Conference will have exclusive access to over 100 technical presentations on-demand from Sept. 28-Oct. 23, as well as the ability to download all papers in the conference proceedings. Register for the free expo-only experience or the full technical conference package at https://smta.org/mpage/smtai-reg.