In Versatile TIM Solution with Chain Network Solder Composite, Dr. Ning-Cheng Lee, Vice President of Technology, will examine how the demand for faster, more powerful devices in the electronics industry makes thermal management a high priority as the need for improved high-performance materials continues to grow. While common thermal interface material (TIM) solutions like thermal grease, thermal gel, solder preforms, and liquid solder all have their own benefits, they can also be subject to common reliability issues, including outgassing, voiding, and pump-out. Dr. Lee examines the development of a novel TIM solution with a high-melting Cu chain network that prevents these defects.
The leap into the 5G era has increased the demand for the performance improvement of mobile phones and the quantity of radio frequency (RF) front-end integrated circuits (IC). In Ultra-Low Residue Flux Application in RF Front-End Package, Leo Hu, Area Technical Manager, will discuss how ultra-low residue (ULR) flux, an innovative, truly no-clean, flip-chip bonding material, meets the need for enhanced performance. By using ULR flux, the typical water-wash cleaning process can be removed and, in some instances, package reliability is improved as well. This simplified assembly process will help to reduce total packaging costs. Hu’s presentation will discuss the application of ULR flux on land grid array and quad flat no-leads/dual-flat no-leads package for RF front-end ICs, as well as the reflow process control. The solder joint strength and reliability study will also be shared.
Dr. Lee has been with Indium Corporation since 1986. He has more than three decades of experience in the development of fluxes, alloys, and solder pastes for SMT industries. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermally conductive materials. Dr. Lee has been recognized by numerous industry organizations for his research, including SMTA, IEEE, and CPMT, and is an IEEE fellow. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with “Best of Conference” awards.
Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has nearly 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at top 10 outsourced assembly and test (OSAT) companies, including Process Engineer, Project Engineer, Senior R&D Engineer, and Chief Engineer. He has a master’s degree in IC Engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.