Indium Corporation’s Leo Hu, senior area technical manager – East China, will present on fine feature solder paste printing for SiP at SiP Conference China, May 21, Shanghai, China.
The industry has seen a surge in demand for system-in-package (SiP) devices, which are capable of increased functionality and higher performance, as well as other benefits, in a smaller package design. These advantages—combined with heterogeneous integration—continue to push miniaturization forward in the quest to create smaller stencil apertures (such as below 90µm) and tighter gap between pads (such as below 50µm). At the same time, these advancements have necessitated more critical solder paste printing requirements. In Fine Feature Solder Printing for SiP, Hu will examine Type 6 and Type 7 ultrafine pitch solder paste printing, commonly used for these applications due to the smaller aperture designs. He will also share data that explains the influence of powder size vs. area ratio, how powder size affects printing performance, application notes, and a related case study.
Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has nearly 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a master’s degree in IC engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
For more information on Indium Corporation’s ultra-low residue fluxes, visit www.indium.com/fluxes or visit Indium Corporation’s booth.