Shrinking stencil apertures and gaps between pads have necessitated more critical solder paste printing requirements. Indium Corporation expert Leo Hu, senior area technical manager, will cover these conditions and more when he presents on fine feature solder paste printing for heterogeneous integration assembly at SiP Conference China, Sept. 27-29, Shenzhen, China.
Increased functionality, higher performance, faster time to market, lower cost, and increasing miniaturization requirements on SiP passives are the driving forces behind the adoption of heterogeneous integration. As stencil apertures shrink below 90µm and gaps between pads fall below 50µm, this solution allows more chips to be integrated into a single package under very tight conditions.
In Applications of Fine Feature Solder Paste Printing for Heterogeneous Integration Assembly, Hu will cover Type 6 and Type 7 ultrafine pitch solder paste printing; share SPI data addressing different area ratios that explains the influence of powder size, flux vehicle vs. area ratio, and printing performance; and discuss the application of water-soluble paste. He’ll also discuss a related case study and Indium Corporation’s new offering—SiPaste® C201HF, a cleanable paste designed to accommodate fine feature printing.
Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has nearly 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a master’s degree in IC engineering from the Chinese Academy of Science, and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.