Durafuse LT, Indium Corporation’s award-winning low-temperature alloy technology, will be the focus of a presentation by Dr. HongWen Zhang at the International Microsystems, Packaging, Assembly and Circuits Technology conference (IMPACT), Dec. 21-23, Taipei, Taiwan.
Low-temperature solders with peak reflow temperatures of 200°C and below have been extensively studied, including the 2017 iNEMI Board and Assembly Roadmap which forecast a 20 percent adoption rate of low-temperature solders for board assembly by 2027. BiSn solders are the leading candidates in these studies, however, the intrinsic brittleness of Bi renders poor drop shock performance and compromised reliability.
In A Novel Lead-Free, Low-Temperature Solder with Excellent Drop Shock Resistance, Dr. Zhang will examine the benefits of Indium Corporation’s Durafuse™ LT, a patent-pending, innovative low-temperature alloy technology that offers enhanced reliability with drop shock performance two orders of magnitude better than Bi-containing solders.
Dr. Zhang is manager of the Alloy Group within Indium Corporation’s Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high-reliability applications. He and Dr. Ning-Cheng Lee invented the mixed powder solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control the joint’s morphology, thus improving the reliability. On the basis of this technique, the Durafuse™ LT, BiAgX®, and Durafuse™ HT solder systems were invented to meet the market need. He has published more than 20 papers and journal articles. Dr. Zhang received his Ph.D. in materials science and engineering, as well as a master’s degree in mechanical engineering from Michigan Technological University. He holds a Lean Six Sigma Green Belt and is a certified IPC specialist for A-600 and IPC-A-610D.