Indium Corporation Expert to Participate in Low-Temperature Solders Debate

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Indium Corporation’s Chris Nash, Product Manager, PCB Assembly Solder Paste, will participate in a Global SMT & Packaging debate on low-temperature solders on Tuesday, December 8 at 10:30 a.m. Eastern Time (3:30 p.m. British Time/11:30 p.m. Malaysia Time).

Following Global SMT & Packaging’s successful June debate on low-temperature solders, the December event will revisit the topic by examining some of the latest techniques, as well as materials and processes to meet the challenges of working with low-temperature solders.

The debate will be followed by a live Q&A session.

For more information or to register for the debate, visit

If you’re looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar at