Indium Corporation’s Chris Nash, Product Manager, PCB Assembly Solder Paste, will participate in a Global SMT & Packaging debate on low-temperature solders on Tuesday, December 8 at 10:30 a.m. Eastern Time (3:30 p.m. British Time/11:30 p.m. Malaysia Time).
Following Global SMT & Packaging’s successful June debate on low-temperature solders, the December event will revisit the topic by examining some of the latest techniques, as well as materials and processes to meet the challenges of working with low-temperature solders.
The debate will be followed by a live Q&A session.
For more information or to register for the debate, visit https://us02web.zoom.us/webinar/register/WN_uT6QdlrkQAC0eaBZ13MIeQ.
If you’re looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar at www.indium.com/webinar.