Indium Corporation’s Dr. Ron Lasky, senior technologist, will host a webinar comparing past iNEMI roadmappredictions with their outcomes on Thursday, Aug. 10 at 7 a.m. San Francisco/10 a.m. New York/3 p.m. London as part of the company’s free webinar program, the InSIDER Series.
In this webinar, Dr. Lasky will compare past board assembly roadmaps with actual technological outcomes. He will examine the progression of predictions across seven significant aspects of board assembly covered in five significant roadmaps: 1) Conversion Costs, 2) NPI Cycle Time, 3) Component Trends, 4) Solder Paste, 5) Bar Solder, 6) Wave Solder Flux, and 7) Die-Attach Adhesives. As Dr. Lasky will explain, the conclusions are mixed: some aspects that the roadmaps covered were very accurate, while others could use improvement. NPI predictions were found to be extremely accurate quantitatively as well as qualitatively. On the opposite end, component trends saw the most discrepancy between the roadmaps’ predictions and actual technological outcomes. Also, maximum I/O density, minimum pitch for area array packages, and chip speed placement were all overestimated markedly, especially in the earlier roadmaps. He will discuss general conclusions on the outline and readability of the board assembly roadmaps.
Dr. Lasky’s webinar is offered as part of Indium Corporation’s free webinar program, the InSIDER Series. You can register for his webinar at https://indium.news/3qxHZLa.
Dr. Lasky is a senior technologist at Indium Corporation, as well as a professor of engineering and the director of the Lean Six Sigma program at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Dr. Lasky has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, and has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering, and science and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of Surface Mount Technology Association’s (SMTA) SMT Process Engineering Certification program and exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded SMTA’s Founder’s Award in 2003.