AMD Unveils Purpose-Built, FPGA-Based Accelerator for Ultra-Low Latency Electronic Trading
New AMD Alveo fintech accelerator card provides trading firms and brokerages with breakthrough trade execution performance at nanosecond speed and AI-enabled trading strategies — — Solution partners Alpha Data, Exegy and Hypertec add to growing ecosystem of ultra-low...
GlobalFoundries® and Microchip Announce Microchip’s 28-nm SuperFlash Embedded Flash Memory Solution in Production
GlobalFoundries (GF®) (Nasdaq: GFS) and Microchip Technology (Nasdaq: MCHP), via Microchip’s Silicon Storage Technology® (SST®) subsidiary, today announces the immediate release to production of the SST ESF3 third-generation embedded SuperFlash technology NVM solution...
Shaping the Future of Display Technology at FINETECH JAPAN 2023
Running in conjunction with Highly-Functional Material Week TOKYO, the 33rd FINETECH JAPAN returns to showcase the latest advancements in LCD, OLED, and Micro-LED technologies from October 4 to 6 at Makuhari Messe, Japan, reaffirming its status as the foremost...
Founder of HyRel Technologies Brian Watson to Present at SMTA International on Workforce Development
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to announce that Brian Watson, the company’s Founder and President, will be a featured presenter at SMTA International. The event is scheduled to take place on Tuesday,...
Transition Automation Updates Innovative Paste Retainers
Transition Automation, Inc. has improved the unique Paste Retainer System that is included in the company’s line of squeegee holder systems. The Soft-Touch™ Paste retainers now have a dual pin locking that better secures the white dam portion. Additionally, the...
Nihon Superior’s Mr. Keith Sweatman to Present at the 2023 SMTA International Technical Conference
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, is pleased to announce that Keith Sweatman, the company’s Senior Technical Advisor, will deliver a presentation titled “A Path to Ductile Low-Temperature Solders for...