Hernon Manufacturing Introduces Tuffbond® 321 for Casting, Potting and Encapsulating Components

Hernon Manufacturing, Inc., a leading producer of high-performance adhesives, sealants, UV LED curing lights and precision dispensing systems, is pleased to introduce Tuffbond® 321. The flexible, low viscosity, general-purpose resin system is used for casting, potting and encapsulating electrical and electronic components. 

 This unique flexible epoxy has low chlorine content and is formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties. “This product is so soft that it can be folded over itself without damage,” says Drew Richards, Hernon’s Marketing Manager. “And its clarity is remarkable as well.” Hernon also offers this formula in black to obscure proprietary materials.

Typical applications for the clear epoxy include: 

  • Potting electronic boards
  • Encapsulating electrical and electronic components
  • Transformers
  • Coils and chokes
  • Solenoids
  • Micro circuitry