BTU International, Inc., a leading supplier of advanced thermal processing equipment for electronics manufacturing, is pleased to announce that Fred Dimock, manager of process technology, will host the SMTA Capital Chapter’s first chapter webinar of 2021. The webinar, “Operation of a Vacuum Reflow Oven with Updated Void Reduction Data,” will take place Wednesday, January 20, 2021 at 11 a.m. EST.
This presentation is a sequel to the preliminary data Dimock provided to the chapter in early 2019 and will include an overview of the vacuum reflow process and an explanation of why vacuum reflow is of interest to the electronic assembly industry. The presentation will discuss finalized data from the vacuum reflow void reduction experiment completed at the Universal Instruments Process Laboratory and results from live demonstrations at ACI Technology.
The live demonstrations will include reworked boards that had been previously processed without vacuum reflow and Dimock will describe the refinements that have been made to subsequent vacuum furnaces.
Dimock has extensive experience in thermal processing and has assisted many companies with process refinements over the years. He has authored numerous articles on lead-free solder, process control and the operation of continuous furnaces. He also wrote the chapter on solder reflow for the “Handbook of Electronic Assembly and A Guide to SMTA Certification” by Dr Lasky and Jim Hall. He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard.
Register today to reserve your spot: https://smta.org/events/EventDetails.aspx?id=1463513&group=225180.
For more information about BTU International, visit www.btu.com.