BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will highlight its TrueFlat™ reflow oven technology at SEMICON Taiwan in booth #M1039. The expo is scheduled to take place September 6-8, 2023 at TaiNEX 1 & 2 in Taipei.
“Flat substrates are an industry challenge that require special processing,” says Joe Yang, product manager at BTU. “That’s why the BTU TrueFlat technology ensures that even the most minimal substrates are held flat through the entire reflow process.”
Designed as an addition to the industry-leading Pyramax platform, the TrueFlat technology addresses the critical challenge of substrate warpage.
One of the standout features of TrueFlat technology is its exceptional uniformity, made possible by integrating the Pyramax’s closed-loop convection heating system. By eliminating die tilt and accommodating substrate thicknesses ranging from 0.15 to 0.30mm, TrueFlat technology guarantees consistent flatness.
Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary Wincon™ Windows-based software including factory host/MES interface for Industry 4.0 compliance. This innovative configuration enables manufacturers to achieve reliable and optimal results across a range of applications.
Visit BTU International’s booth at SEMICON Taiwan 2023. To learn more visit www.btu.com.