SHENMAO America to Solve Solder Paste Problems at APEX


SHENMAO America, Inc. today announced plans to exhibit in Booth #2344 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 – March 1, 2018 at the San Diego Convention Center in Ca. The company’s new PF606-P140 / PF606-P245 Lead-free Zero Halogen Solder Pastes can eliminate Head-in-pillow (HiP) defects, voids, slumping, non-wetting opens and short stencil life.

SHENMAO’s PF606-P140 / PF606-P245 pastes improve ICT testability by completely removing flux to prevent contamination of test pins during test operation. Minimal flux residue gathers near the outside of the solder joint on the PCB substrate – a substantial improvement over legacy solder paste. With superior continuous high-speed printability, the pastes produce first-rate solder paste print quality and a wide reflow process window for excellent solderability.

SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.

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