Long-awaited SPI from Yamaha: Providing a one-stop solution from printer to AOI
High-speed 3D solder paste inspection machine “YSi-SP”
Yamaha Motor Co., Ltd. announces the April 1, 2018 release of the YSi-SP, a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections.
The YSi-SP is Yamaha Motor’s first solder paste inspection (SPI) machine. It is used to
inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs.
The YSi-SP handles various high-speed and high-accuracy solder paste inspections with a single head, including high-precision inspections employing a Yamaha-exclusive algorithm combining 2D and 3D-based measurements, and image resolution switch-over utilizing super-high resolution technology.
Tapping into our expertise as a comprehensive manufacturer of a full lineup of surface
mounting machinery, the YSi-SP can swiftly coordinate with other Yamaha machines, such as performing automatic setup changes, automatically adjusting solder misalignment, and automatically converting adhesive inspection data from the dispenser.
While offering Statistical Process Control (SPC) to perform a wide range of statistical processing, the YSi-SP can also be equipped with various optional features, including bonding inspection and foreign matter inspection.
The launch of the YSi-SP enables us to supply all of the primary machines required for mounting processes under the Yamaha brand, from printers and dispensers to solder inspection machines, surface mounters and automated optical inspection (AOI) PCB inspection machines. With all the machinery fully coordinating with each other, clients are able to build a production line with even higher efficiency and quality.
The YSi-SP is on display at the 47th Internepcon Japan electronics manufacturing and mounting technology exhibition to be held at the Tokyo Big Sight (Koto-ku, Tokyo) from January 17 to 19, 2018.