FLEX Taiwan June Debut Showcases Flexible Electronics

2018 Flex Taiwan LogoFLEX Taiwan debuts June 7 at the Taipei International Convention Center (TICC), showcasing the latest flexible hybrid electronics (FHE) technology, innovations and industry insights. Organized by FlexTech, a SEMI Strategic Association Partner, the one-day technical conference provides a powerful platform for connecting with customers, suppliers, future partners and academia to drive collaboration and uncover new opportunities.

Projected to reach US$73.43 billion* by 2027, the global flexible electronics market is expected to be a major growth driver for the microelectronics industry. The lightweight, ultra-thin and foldable features of flexible electronics are inspiring new applications beyond the capabilities of traditional silicon- or glass-based substrates.

Featuring 14 keynote speeches, FLEX Taiwan 2018 brings together leaders across the semiconductor, flat panel display, sensor and other industries. Industry-leading companies including Robert Bosch, Brewer Science, E Ink, Jabil Circuit and top international research organizations will gather to share insights on market trends, innovative materials, advanced manufacturing technology and FHE application opportunities.

“Taiwan is a leader in manufacturing technology and has a complete supply chain for displays,” said SEMI Taiwan President Terry Tsao. “With these strengths, Taiwan is well-positioned to accelerate the commercialization of FHE products.”

For the past 17 years, SEMI and FlexTech have championed the development of the FHE industry through conferences and exhibitions in major microelectronics manufacturing regions such as North America, Europe, Japan, Korea, Singapore and China.

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