Mirtec Europe Ltd
|Telephone:||+44 (0) 1752 696 695|
|Contact Name:||David Bennett|
MIRTEC Europe to Exhibit at What’s New in Electronics Live Event
MIRTEC, “The Global Leader in Inspection Technology,” today announced they are participating in the upcoming What’s New in Electronics Live! event. The show is scheduled for May 9-10 and will take place at the National Exhibition Center in Birmingham, UK.
On display at the show, MIRTEC’s MV-6E OMNI, which is unquestionably the inspection industry’s most technologically advanced AOI system in consideration. The all new MV-6E OMNI 3D In-Line AOI system is configured with MIRTEC’s exclusive OMNI-VISION®3D Inspection Technology which combines our award winning 15 Megapixel ISIS Vision System with MIRTEC’s revolutionary Digital Multi-Frequency Eight Projection 3D system to provide precision inspection of SMT devices on finished PCB assemblies. MIRTEC’s 15 Megapixel ISIS Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with our complete product range of inspection equipment. MIRTEC’s Digital Multi-Frequency Eight Projection Technology provides true 3D inspection using a total of four (4) Programmable Digital Moiré Projectors. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the new MIRTEC MV-6e OMNI machines feature four (4) 10 Megapixel Side-View Cameras in addition to the 15 Megapixel Top-Down Camera.
Also, stop by to see the MV-3L Desktop AOI Machine- the industry’s most widely accepted five (5) camera desktop AOI system. This system is configured with one Top-Down View 10 Mega Pixel camera with a Precision 13.4um Telecentric Compound Lens and four (4) 10 Mega Pixel Side-View Cameras. This advanced technology can also offer four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability via the INTELLI-BEAM® laser measurement option. This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.
MIRTEC Europe prides itself on its business philosophy of providing customers with the highest quality products and services at competitive pricing, and recognizes that customers are the source of future growth and, as such, strives for a strong, reliable and long-term partnership based on trust and respect. MIRTEC Europe is proud to work with Accurex and congratulates them on a banner year of sales!
Visit us on stand 327 – we look forward to seeing you there.