Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is introducing ALPHA® OM-550, a new low temperature chemistry paired with Alpha’s HRL1 alloy for assemblies with temperature sensitive substrates, components and high warpage chips.
“The ALPHA® HRL1 alloy was designed to enable near-SAC305 drop shock and improved thermal cycling performance in low temperature assemblies”, said Phua Teo Leng, Global Portfolio Manager for SMT Assembly at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions Group of Businesses. “This chemistry and alloy pairing is revolutionary as it reduces the soldering temperature required for SAC alloys by 50°C, while dramatically reducing power consumption and carbon emissions.
Assemblers can now benefit from having a cost efficient, highly reliable soldering process with up to 99% less warpage and significantly fewer defects, which is truly unique”.
ALPHA® OM-550 has the characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures, therefore minimizing NWO and HIP defects in complex assemblies.