Alpha Assembly Solutions to Feature Void Reduction & Low Temperature Technologies at 2018 IPC APEX

SCSAlpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will feature its latest Low Temperature Solder and Void Reduction Solutions technologies at Booth #727 at the upcoming IPC APEX Expo in San Diego.

Alpha’s recently launched low temperature solder paste, ALPHA® OM-550, will be the focus among its Low Temperature Solder Solutions. “OM-550 provides another low temperature solution to customers looking for SAC305-type mechanical and thermal reliability in a low temperature alloy,“ said Robert Wallace, Regional Marketing Manager for the Americas. “This is a first rate paste that provides customers with efficiencies in both energy and cost while improving BGA mechanical reliability compared to other low temp alloys.“

Alpha’s Void Reduction Solutions technology combines several of Alpha’s innovative products and assembly processes. “Alpha has developed a reliable low void technology system for bottom terminated components which has shown to dramatically decrease voiding,” said Jerry Sidone, Product Manager for Engineered Materials at Alpha Assembly Solutions. “We will discuss this technology and provide data that addresses the challenges of voiding and managing thermal reliability in the paper presentation, Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat.“ The paper will be delivered on Tuesday, February 27 at the Bottom Terminated Components Session from 1:30 p.m. – 3:00 p.m..

Alpha will be co-exhibiting in Booth #727 with MacDermid Enthone Electronics Solutions. Both Companies are a part of the MacDermid Performance Solutions group of businesses.

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